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The American wafer fabrication gear producer Lam Analysis has accomplished the acquisition of Austria based mostly SEMSYSCO, a worldwide supplier of moist processing semiconductor gear, for an undisclosed quantity. With this acquisition, Lam provides capabilities in superior packaging, supreme for modern logic chips and chiplet-based options for high-performance computing (HPC), synthetic intelligence (AI) and different data-intensive purposes to its portfolio.
“The strategic acquisition of SEMSYSCO furthers our dedication to assist chipmakers handle their rising know-how challenges, including deep capabilities in superior substrates and packaging processes,” mentioned Tim Archer, president and chief govt officer at Lam Analysis. “With modern choices and modern analysis and improvement in packaging, Lam is well-positioned to help our clients as they scale to future chiplet-based applied sciences,” he added.
The acquisition of SEMSYSCO broadens Lam’s packaging choices, bringing a portfolio of modern cleansing and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This contains help of fan-out panel-level packaging, a game-changing course of through which chips or chiplets are lower from a big, rectangular substrate sheet a number of occasions the scale of a conventional silicon wafer. This strategy allows chipmakers to considerably enhance yield and scale back waste.
“Packaging performs an vital position in extending Moore’s Regulation and enabling future management merchandise with larger ranges of system in package deal integration. New substrate-based panel-level approaches are very important to cost-effectively realizing the high-performance chiplet-based options wanted for the digital world,” mentioned Keyvan Esfarjani, chief international operations officer at Intel Company. “We’re happy to broaden our deep, long-standing relationship with Lam to incorporate superior cleansing and plating processes within the new panel kind issue.”
With the acquisition of SEMSYSCO, Lam additionally positive factors a state-of-the-art R&D facility in Austria targeted on next-generation substrates and heterogeneous packaging, broadening the corporate’s robust improvement capabilities in Europe and including a sixth lab in Lam’s international community. As well as, it brings to Lam new and expanded relationships with chipmakers and fabless clients.
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